Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-µm-thick Cu under-bump metallization
Materials Research Society
Jae-Woong Nah, Kai Chen, K.N. Tu, Bor-Rung Su and Chih Chen
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Materials Research Society
Jae-Woong Nah, Kai Chen, K.N. Tu, Bor-Rung Su and Chih Chen
NSTI-Nanotech
S. Pathak, E. Cao, M. Davidson, S. Jin, and G. Silva.
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