Influence of 2D rGO nanosheets on the properties of OPC paste
July 2016
Cement and Concrete Composites
M. Murugan, Manu Santhanam, Soujit Sen Gupta, T. Pradeep, Surendra P. Shah
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-µm-thick Cu under-bump metallization
July 2007
Materials Research Society
Jae-Woong Nah, Kai Chen, K.N. Tu, Bor-Rung Su and Chih Chen
Analysis of Aerial Photography for Nitrogen Stress within Corn Fields
September 1996
American Society of Agronomy
Blackmer, Tracy M.; Schepers, James S.; Varvel, Gary E; Meyer, George E.