3D deconvolution of spherically aberrated images using commercial software.
Journal of Microscopy Model MA, Fang J, Yuvaraj P, Chen Y, Zhang Newby BM.
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-µm-thick Cu under-bump metallization
Materials Research Society Jae-Woong Nah, Kai Chen, K.N. Tu, Bor-Rung Su and Chih Chen
Striped Beautiful Growth (Katsuwonus Pelamis) and a Method for Correction of Defects Resulting from Central Vascularization of Thorns Fin Dorsal
BRAZILIAN JOURNAL OF AQUATIC SCIENCE AND TECHNOLOGY – BJAST H. A ANDRADE, J. L. ABREU-SILVA, M. DUARTE-PEREIRA
Quantum Dot Nanocrystals in Neuroscience
NSTI-Nanotech S. Pathak, E. Cao, M. Davidson, S. Jin, and G. Silva.
Analysis of Aerial Photography for Nitrogen Stress within Corn Fields
American Society of Agronomy Blackmer, Tracy M.; Schepers, James S.; Varvel, Gary E; Meyer, George E.